Date
Place
- Room H (Room Hall 1, 1F)
- P1. Poster Session I
- August 20, 2015 (Thursday)
- 14:00 ~ 15:30
- [P1-24]
- 14:00 ~ 15:30
- Title:Stretchable and Deformable LED Configurations Based on Inkjet-Printed Chip-Bonding Technology
- Junghwan Byun, Byeongmoon Lee, Eunho Oh, Sangwoo Kim, Hyunjong Kim, Seongdae Choi, and Yongtaek Hong (Seoul Nat'l Univ., Korea)
Abstract: In this work, we introduce a novel in-situ inkjet-printing-based chip-bonding technology. Like a conventional flip chip bonding technology, commercially available LED chips (1 mm x 0.9 mm x 0.2 mm) are successfully bonded directly onto the soft substrate in precisely controlled configuration using a placement machine and a facile inkjet-printing technique. In addition, we simply demonstrate all-printed stretchable and deformable LED arrays combined with prestretching process. The technology presented here would show the potential of printable and stretchable hybrid systems, where commercially addressable functional chips or dies can be directly integrated.
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